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Signal integrity (SI) analysis based on state-of-the-art measurements can be difficult to perform especially when the structures of interest are on inner layers of multilayer boards or are enclosed by IC packages. To enable an SI analysis in such cases the authors have recently developed a method that is based on the extraction of accurate simulation models from computed tomography (CT) scans. These...
In this paper, a method for signal integrity (SI) analysis based on computed tomography (CT) scans is proposed. SI analysis based on state-of-the-art measurements can be difficult to perform if the structures of interest are on inner layers of multi-layer boards, are enclosed by IC packages or if appropriate contacts for measurements cannot be provided due to cost and space reasons. In contrast to...
This paper presents a method for S-parameter extraction of passive sub-circuits embedded in complex microwave circuits. We employed computed tomography (CT) scans and measured substrate material parameters. The principle is based on the automatic reconstruction of CAD models from CT image data. Such CAD models represent the geometry of the actual manufactured passive microwave circuits and are suited...
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