Search results for: Rao R. Tummala
Journal of Electronic Materials > 2018 > 47 > 12 > 7401-7408
IEEE Transactions on Device and Materials Reliability > 2017 > 17 > 4 > 683 - 691
Journal of Electronic Materials > 2018 > 47 > 1 > 368-377
Journal of Materials Science: Materials in Electronics > 2017 > 28 > 24 > 18773- 18780
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 9 > 1493 - 1505
IEEE Transactions on Device and Materials Reliability > 2017 > 17 > 3 > 585 - 592
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 9 > 1410 - 1418
IEEE Transactions on Electromagnetic Compatibility > 2017 > 59 > 3 > 940 - 951
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 6 > 829 - 837
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 4 > 544 - 551
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 2 > 178 - 185
IEEE Transactions on Device and Materials Reliability > 2016 > 16 > 4 > 622 - 630
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 12 > 1776 - 1784
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 10 > 1561 - 1566
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 6 > 959 - 967
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 5 > 775 - 783