The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
We present a phase noise analysis on a frequency-modulated continuous-wave (FMCW) radars at millimeter wavelengths to achieve a transmit power up to 1 Watt. To attain high transmit power, we describe a FMCW radar design that satisfy two characteristics. First, high transmit/receive (T/R) isolation better than 80 dB, obtained through a quasioptical duplexing method and high directivity horns. Second,...
Millimeter-wave communications are expected to play a key role in future 5G mobile networks to overcome the dramatic traffic growth expected over the next decade. Such systems will severely challenge antenna technologies used at mobile terminal, access point or backhaul/fronthaul levels. This paper provides an overview of the authors' recent achievements in the design of integrated antennas, antenna...
A 60-GHz transceiver module fully integrated on silicon interposer technology is demonstrated for the first time. The module includes a 65-nm CMOS RFIC transceiver and two antennas (transmit, receive) in a very compact volume (6.5×6.5×0.6 mm3). The fabrication process is presented. The design and measurements of the antenna demonstrate very good performances with a good impedance matching over the...
A novel design of millimeter-wave antennas integrated with a high-impedance surface (HIS) reflector is presented within the particular context of 3D heterogeneous integration on silicon interposer an its specific requirements. Then, the design steps of a 60-GHz folded dipole antenna for short-range communications are detailed. Simulation and measurement results show promising performances in terms...
This paper deals with the wideband frequency molding material characterization in three dimensions stack of integrated circuits (3-D IC). This material is required as a passivation layer at the top of an element called interposer. The interposer constitutes a platform that allows to connect heterogeneous chips, for example, a radio frequency transceiver, a low-noise amplifier, and an antenna. As the...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.