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A monolithic 3D image sensor is demonstrated by sequentially fabricating large-area (>2cm×2cm) monolayer (<1nm) transition metal dichalcogenide (TMD) phototransistor array on top of a 3D logic/memory hybrid 3D+IC connected by high density interconnect. The photocurrent of the monolayer MoS2 phototransistor shows a linear response to the incident laser power density and exhibits high responsivity...
High performance 3D sequentially stackable nanowire FETs and non-volatile memories (NVMs) with threshold voltage engineering and driving current boosting technologies were demonstrated by using low thermal budget nanosecond laser crystallization and laser activation technologies. The local heating laser process without damaging the underlying device/circuit realizes the across-layer and in-layer integration...
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