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In this paper, both isothermal and dynamic differential scanning calorimetry (DSC) are employed to characterize the thermal properties of two commercial epoxy molding compounds designated as EMC-A and EMC-B respectively. In dynamic curing, the heat flow of uncured powder samples weighting 10±0.5 mg are measured at the heating rates of 5, 10 and 15 °C /min from room temperature to 220 °C. The isothermal...
In this paper, both isothermal and dynamic differential scanning calorimetry (DSC) are employed to characterize the thermal properties of two commercial epoxy molding compounds designated as EMC-A and EMC-B respectively. In dynamic curing, the heat flow of uncured powder samples weighting 10±0.5 mg are measured at the heating rates of 5, 10 and 15 °C /min from room temperature to 220 °C. The isothermal...
The thermal fatigue reliability of solder bumps in TSV interposer package is analyzed by finite element method. The 3D finite element model of TSV interposer package is established in ANSYS software. Anand constitutive model is adopted to describe the viscoplastic behavior of Sn3.0Ag0.5Cu lead-free solder bumps. The influences of material properties and structural geometries on thermal fatigue reliability...
A DOE (Design of Experiment) methodology based on finite element analysis is presented to investigate thermal fatigue reliability of multi-row QFN packages. In this method, the influences of material properties, structural geometries and temperature cycling profiles on thermal fatigue reliability are evaluated, a L27(38) orthogonal array is built based on Taguchi method to figure out optimized factor...
TSV interposer packaging is one of the most important applications for TSV technology. However, the warpage and residual stress arising from the assembly process of TSV interposer have important influence on the reliability of the package. In this paper, two assembly processes were simulated by using the Finite Element Method, the evolution of the stresses and warpage during assembly were compared...
Infrared thermography has become increasingly important for non-destructive testing to detect internal defections, involving delaminations, cracks and voids. In this paper, the principle of infrared thermography is presented briefly. And a finite element approach is proposed to simulate the process of infrared thermography nondestructive testing about QFN packages. By changing with the length and...
Atomic diffusion in soldering process leads to growth and stress developed in the intermetallic compound layer in solder joints. The stress and morphological evolution of the intermetallic compound layer, which is driven by the stress, result in degradation of mechanical performance of solder joints. Microstructure of the intermetallic compound layer in solder joints is modeled. The model consists...
Interfacial fracturing is the most important failure mode of solder joints. In this paper, interfacial stresses of Cu pad/solder interfaces are evaluated based on the theory of interfacial mechanics and the finite element method. Effects of solder joint shapes and solder materials on the stress intensity are investigated. The results show that Sn37Pb/Cu interface has greater stress intensity than...
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