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A method for making thin copper foil attached carrier was developed without additional release layer on carrier in this study. The carrier copper foil was two-layered structure, carrier and copper foil, which was different from the traditional three-layered. Copper is directly electrodeposited on certain carriers which have spontaneous and conductive oxides formed on surface. The oxides will be utilized...
With the best tolerance and thermal stability among the commercially available embeddable resistor products, thin film resistors having copper foil as carrier have been expected to be one of the most potential candidates for meeting the future HDI development trend of PCB manufacturing process. However, before the potential can be realized, the problem of too small sheet resistivity - 250??/?? max...
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