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Two test chips have been designed to determine the performance, yield and reliability of 3D chipstacks using Through Silicon Vias (TSVs). One of the chips uses via-middle technology while the other uses via-last technology. Both chips are fabricated in a commercial foundry using a 65 nm CMOS process. Both chips contain test structures designed to measure performance of transistors and other active...
A test chip has been designed and fabricated to validate the performance, yield and reliability of 3D chipstacks using Through Silicon Vias (TSVs). The test chip contains test structures designed to measure the electromigration performance of TSVs and microbump, thermal performance, stress in the chip as a result of thinning and die stacking, and corrosion related to moisture ingress. The structures...
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