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In this paper, we demonstrate an approach for the local synthesis of ZnO nanowires (ZnO NWs) and the potential for such structures to be incorporated into device applications. Three network ZnO NW devices are fabricated on a chip by using a bottom-up synthesis approach. Microheaters (defined by standard semiconductor processing) are used to synthesize the ZnO NWs under a zinc nitrate (Zn(NO3)2·6H2...
In this study, anodically-bondable LTCC (low temperature cofired ceramic) substrates are proposed to provide electrical connective packaging by using novel nano-structured gold. On-chip MEMS compatible fabrication of nanoporous gold (NPG) was developed and its porous structure offers sponge-like functions which forms electrical contacts as well during anodic bonding. A MEMS integrated Si substrate...
In this study, for the first time we successfully bonded Si substrates with sputtered Zr-Al-Cu-Ni metallic glassy material. The surface pre-treatment with formic acid vapor plays a remarkable function for oxides removal before bonding. Metallic glasses have fundamentally glassy structure and exhibit a Newtonian viscous flow in the supercooled liquid region. The polymer-like plastic fluidity performs...
<para> GaN-based metal–semiconductor–metal ultraviolet photodetectors (PDs) prepared on a patterned sapphire substrate (PSS) and a conventional flat sapphire substrate were both fabricated and characterized. It was found that we can reduce dark leakage current and enhance by about two orders of magnitude by using a PSS. The internal gain of the PDs prepared on a PSS was also much smaller. </para>
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