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This paper describes the potential of different nano- and micro-sized particles as additives for plastic packaging materials for enhanced humidity resistance/barrier enhancement within microelectronic packages as well testing methods for material characterization concerning their humidity diffusion and absorption properties. This topic is gaining increased importance when considering the trend towards...
This paper describes the design, simulation and measurement of interconnects of buried active 77 GHz chips to a high frequency substrate using microvia technology. The embedding technology proposed offers great opportunities for a very broad range of frequencies and applications as well as a large potential for cost reduction.
Polymer materials - mainly epoxy resins - are widely used in microelectronics packaging. They are established in printed circuit board manufacturing, for adhesives as die attach glues or for encapsulants as molding compounds, glob tops or underfill materials. Low cost and mass production capabilities are the main advantages of these materials. But like all polymers they can not provide a hermetical...
The degree of integration of modern circuits has gone from singledie towards multi-die or even system partition integration. System-In-Package concepts allow to integrate in a hybrid form circuit components steming from different manufacturing processes e.g. CMOS, GaAs, MEMS as well as SMD chips. Combining Flip Chip technology, advanced PCB manufacturing, advanced assembly processes and large area...
In the field of microelectronics encapsulation transfer molding is the process of choice for high volume and high reliability encapsulation of microelectronics devices. The materials used for transfer molding are highly filled epoxy based systems, with typically good CTE matching to encapsulated components and high media and temperature resistance. Especially harsh environment applications as automotive,...
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