The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
A new and fast WLCSP (Wafer Level Chip Scale Package) evaluation method has been provided to cover different kinds of factors, such as die size, solder ball pitch, PCB (Printed Circuit Board) designs, etc. In this work, 2 TVs (Test Vehicles) with larger die size are designed to reveal the behaviors of various factors, and 1 TV with finer ball pitch is used to both confirm the behaviors of the 2 large...