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It is well known that 3D channel devices, such as double-gate (DG) and tri-gate (TG) FinFETs, provide excellent short-channel effect (SCE) immunity. Thus, the scaled 3D channel FinFET flash memories with oxide-nitride-oxide (ONO) charge trapping layers have actively been developed [1–3]. Very recently, we have also developed floating-gate (FG) type SOI-FinFET flash memories [4–7]. In this paper, we...
We experimentally investigated the device performance of n+- poly-Si/PVD-TiN stacked gate FinFETs with different Hfin's. It was found that mobility enhances in the tall Hfin devices due to the increased tensile stress. However, as Lg decreases, Ion for tall Hfin case becomes worse probably due to high Rsp. It was also confirmed that Vth variation increases with increasing Hfin due to the rough etcing...
Semitransparent flexible resistive-switching memory devices, using amorphous InGaZnO as the switching layer, are fabricated on plastic substrates at room temperature. The device shows high performance, excellent flexibility, and mechanical endurance in bending tests. No performance degradation occurs, and the stored information is not lost after bending the device to different angles and up to ...
The Vt variability in scaled FinFETs with gate length (Lg) down to 25 nm was systematically investigated, for the first time. By investigating the gate oxide thickness (Tox) dependence of Vt variation (VTV), the gate-stack origin, i.e., work-function variation (WFV) and gate oxide charge (Qox) variation (OCV) origin VTV were successfully separated. It was found that the atomically flat Si-fin sidewall...
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