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Automotive electronic units need to comply fully with electromagnetic compatibility (EMC) regulations. This paper proposes a comprehensive simulation methodology and techniques for analyzing EMC performance of integrated circuits (ICs) in chip-package-system (CPS) board integration. Extended chip power models (ECPMs) model automotive ICs for noise emission (EMI) and also for noise susceptibility (EMS),...
A comprehensive ESD dynamic methodology is developed for failure diagnosis and predictive simulation of improvements. This methodology focuses on dynamic analysis including modeling of die-level metal grid, substrate grid and well-diode, package effective capacitance, and pogo pin. Real HBM and CDM application examples are illustrated.
An efficient layout-based multi-domain ESD analysis and verification method has been developed for large SoC designs containing thousands of bumps. A fast resistance and current density check for ESD discharging paths across multiple diodes/clamps represented as I-V curves is performed, including on-chip signal/power/ground/package grid. Real application examples are shown.
A fully integrated framework of full-chip power and substrate noise analysis is discussed, featuring description of transistor-level custom circuits as dynamic noise sources, a high capacity solver for chip-level substrate coupling, and noise back annotation flow to transistors of sensitive circuits. Recursive evaluation of power current and operation timing under the presence of dynamic IR drop greatly...
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