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A new technique to enhance the metal segregation at NiSi/Si interface for reducing contact resistance in source/drain electrodes is proposed. It is demonstrated that metal segregation at the junction of pre-amorphized NiSi/Si using ion-implantation leads to reduction of Schottky barrier height by > 0.2 eV. This modulation width is far beyond the previous metal segregation technique [1] and allows...
This paper studies the Schottky barrier height (SBH) modulation effect induced by dipoles generation at the nickel silicide (NiSi)/silicon (Si) interface, based on first-principles calculations. Dipole comforting SBH is dramatically reduced to 0.1 eV in 1 nm region around the interface for the case of B atoms substituted for Si atoms. The results suggest that NiSi with appropriate dopant preparation...
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