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Commonly, during the process development cycle for new products, limitations exist on the materials that are available for the prototype work. Most SMT devices are readily available in different formats and solder alloys to satisfy most of the needs for passive components, however, many times, IC devices are limited to what is available from the fab or IC brokers. These limitations range from die...
Flip chip process excels due to its low cost, fine pitch, small form factor and its ready-adaptation to the conventional Surface Mount Technology (SMT) process, in the fact that the reflow is often used to form the solder joint. As the use of Pb free solder is legislated today, it is vital to understand the impact of reflow process conditions on the formation of the flip chip solder joint, so that...
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