The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
For use in a chip-scale-packaged parallel optical receiver module, a 125-μm-pitch oblique cone-shaped optical pin array has been developed as an input/output (I/O) interface, and a glass interposer with regularly-arranged 250-μm-pitch through-glass-vias has been developed as an electrical I/O interface. An 8°-tilted cone-shaped optical pin was fabricated by oblique illuminated photolithography. It...
A chip-scale package structure for Si photonic optical transceivers has been developed. The foot print of the transceiver is 5 mm × 5mm. By using an optical pin array and glass interposer with through-glass vias (TGVs), high density optical and electrical I/O interfaces are configured on one side of the package. The optical pin acts as a vertical waveguide or spot-size converter (SSC). The combination...
We developed 5 mm square Si-photonics-based chip-scale optical transmitters/receivers called “optical I/O cores”. The power consumption of their hybrid-integrated ICs is 5 mW/Gbps. We demonstrated 25-Gbps/ch error-free operation over 300-m MMF in the O band.
We have developed an optical I/O structure using an array of optical pins for a chip-scale parallel optical module named an “optical I/O core.” The optical pin is a kind of vertical polymer waveguide, which is made from UV curable resins. The optimum shape and combination of resins for the optical pins were determined by ray-trace simulation. The numerical aperture (NA) of the developed optical pins...
Miniaturized electromagnetic bandgap (EBG) structures with a stopband that covers the 2.4 GHz band have been developed, and their integration to Si and glass interposers has also been studied. The unit cell size can be reduced down to 0.7 mm × 0.7 mm by combining thin film dielectrics with inductance-enhanced EBG structures. The appearance of the bandgaps can be controlled by the dielectric layer...
We evaluated low-impedance power distribution network (PDN) of decoupling capacitor embedded interposers for 3-D integrated LSI system. Measurements are carried out using the developed impedance analyzer system of a wide frequency range for evaluating ultralow impedance, and calculations are carried out using 2.5-D finite element method (FEM) electromagnetic field simulator. We fabricated various...
Lysophosphatidic acid (LPA) triggers the invasion of a mesothelial cell monolayer by rat ascites hepatoma (MM1) cells. LPA also induces rapid morphological changes of MM1 cells, cell surface blebbing and pseudopodia formation. Pseudopodia formation is tightly correlated with cellular invasiveness. Clostridium Botulinum C3 exoenzyme and genistein abrogated the formation of blebs and pseudopodia together...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.