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One critical obstacle to preparing highly reliable isotropically conductive adhesives (ICAs) filled with Ag-coated Cu flakes is the oxidation and corrosion of Ag-coated Cu fillers, which cause the degradation of electrical properties of the ICAs at elevated temperatures and relative humidity (RH) during long-term reliability tests. Various organic compounds could be used for corrosion prevention of...
One of the main drawbacks of silver-filled isotropically conductive adhesives (ICAs) is the high cost of silver fillers, while low cost copper-filled ICAs are not reliable due to the oxidation of copper fillers. In this paper, we develop highly conductive, highly reliable, and low cost ICAs filled with silver-coated copper (Ag-coated Cu) flakes, i.e. an anhydride-cured ICA filled with Ag-coated Cu...
In a continuous drive to achieve low form-factor packages, chip-to-package interconnections have evolved from the conventional solders to a more hybrid technology consisting of copper and solder. However, scaling down the bump pitch to increase the interconnect density poses serious reliability and yield issues. In the previous, a low-profile interconnect architecture, ~20µm total height, was demonstrated...
Vertically aligned carbon nanotubes (VACNTs) grown on bulk copper substrate are of great importance for real-life commercial applications of carbon nanotubes (CNTs) as thermal interface materials in microelectronic packaging. However, their reproducible syntheses have been a great challenge so far. In this study, by introducing a well-controlled conformal Al2O3 support layer on the bulk copper substrate...
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