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A low-cost, three-dimensional multichip module (MCM) technology provides greatly improved system density and reduced mass over planar packaging technologies. The technology offers a high degree of testability that negates the need for known good die (KGD) procurement. Testing is achieved with very low cost overheads and with no increase in the volume of the module. The technology allows complete,...
This paper describes the architecture and design of a public key encryption processor which implements the RSA algorithm with key lengths of 512 bits. The chips, which are 6.2 by 4.2 millimetres and contain 50,000 gates, have been designed in a 0.7 micron CMOS, silicon on insulator process and in a 0.7 micron bulk CMOS process. The chips are functionally identical and each form a self contained subsystem...
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