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Three Dimensional (3D) chip stacking technology is emerging as a viable candidate to address the memory bandwidth problem by stacking multiple DRAM layers on top of a multiprocessor layer (logic layer) to reduce wire delay and energy consumption between them. In addition, combining the benefits of 3D memory-on-processor stacking architecture and on-chip networks provides a significant performance...
This paper presents a novel virtual-channel (VC) sharing technique for NoC architecture. The proposed architecture improves the utilization of resources to enhance the performance with minimal overheads. A heuristic approach towards the proper VC sharing strategy is proposed, which is performed by an adaptive algorithm that configures the VC sharing based on link load parameters. Architectural design...
Three Dimensional Integrated Circuits (3D ICs) are emerging to improve existing Two Dimensional (2D) designs by providing smaller chip areas, higher performance and lower power consumption. Stacking memory layers on top of a multiprocessor layer (logic layer) is a potential solution to reduce wire delay and increase the bandwidth. To fully employ this capability, an efficient on-chip communication...
In this paper, a 3D NoC architecture based on Bidirectional Bisynchronous Vertical Channels (BBVC) is proposed as a solution to mitigate area footprints of vertical interconnects. BBVCs, which can be dynamically self-configured to transmit flits in either direction, enable the system to benefit from a high-speed bidirectional channel instead of a pair of unidirectional channels for inter-layer communication...
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