The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this study, the formation mechanisms of Kirkendall voids in Sn3Ag0.5Cu/Cu and Ni/Sn3Ag0.5Cu/Cu joints were investigation, and the coupling effect of joint size and Kirkendall voids on the fracture features of Ni/SnAgCu/Cu joints were also studied. It was found that the size effect had a significant influence on the formation of Kirkendall voids at Cu side in Sn3Ag0.5Cu/Cu and Ni/Sn3Ag0.5Cu/Cu joint,...
In this study, the formation mechanisms of Kirkendall voids in Sn3Ag0.5Cu/Cu and Ni/Sn3Ag0.5Cu/Cu joints were investigation, and the coupling effect of joint size and Kirkendall voids on the fracture features of Ni/SnAgCu/Cu joints were also studied. It was found that the size effect had a significant influence on the formation of Kirkendall voids at Cu side in Sn3Ag0.5Cu/Cu and Ni/Sn3Ag0.5Cu/Cu joint,...
Five group thermal resistance test samples of the power devices were performed high temperature aging at 150°C for 0h, 24h, 48h, 72h, 96h respectively, then the maximum thermal test current without device self-heating temperature rise of 5mA was determined, and the transient thermal resistance test method was employed to obtain the heat transient response curves containing the thermal resistance and...
Light-emitting diodes (LEDS) are a strong candidate for the nest-generation general illumination applications. The reliability of LEDs is the key point for its applications, and the main challenges facing the development of high reliable LED is packaging process. In this paper, the overview of state of the art techniques in LED failure analysis is provided, and the main failure modes such as bonding...
This paper focuses on the Burn-in Screening Technology of Power Bare Die. A temporary carrier that allows the power bare die full temperature testing and burn-in has been described. A suitable improvement multi-bump contact carrier technology has been put forward and Experiment results have shown that the contact resistance of the new carrier decrease 40% significantly. Base on the peak value junction...
The reliability, long-term performance and lifetime of high power diode lasers are important issues for pumping of solid state and fiber laser systems. In order to obtain the lifetime data of high power QCW 808 nm cm-bars, we have set up a computer controlled diode array reliability experiment which can automated monitor the laser arrays 24 hours a day. Using this setup 10 high power QCW cm-bars currently...
Great advances in microelectronics failure physics, process reliability, reliability test and evaluation and failure analysis technologies have been achieved in China recently. Some of the significant achievements include the hot-carrier injection (HCI) degradation model, gate oxide TDDB, negative bias temperature instability (NBTI) of very deep sub-micro(VDSM) devices, process quality parameter monitoring...
We report here the lifetime testing of 10 high power cm-bar arrays using an automated diode array reliability experiment. The devices are tested at 25degC/100A, with a pulse width of 200 mus and a duty factor of 2%. Most devices survive more than 1.0times109 shots. Failure analysis results on the few failing devices reveal failure modes of mechanical stress, chemical contamination and thermal migration.
Package is a key factor, and affects the reliability of LED. In this paper, the main failure modes and mechanisms that caused by poor package process were investigated through some failure analysis cases, and some improving methods to improve the LED's reliability are put forward.
A method based on magneto-acoustic technique is developed to measure bioelectric currents non-invasively. Theoretically, vibrations of particles in the medium are produced due to the Lorentz force when oscillatory currents flow through medium in a steady magnetic field. These vibrations contain information of the bioelectric currents and can be detected by surface contact detector. An experimental...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.