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Double-sided insulated gate bipolar transistor (IGBT) assemblies bonded by sintered nanosilver are fabricated in this paper. Die-shear tests reveal that the lowest bonding strength between the chip and the substrate of the assemblies is about 20 MPa. Furthermore, temperature cycling tests ( to 150 ) indicate that the shear strength declines as the number...
To have a full description of the fatigue behavior of nano-silver sintered lap shear joint, isothermal low cycle mechanical fatigue test was conducted in a systematic manner over a wide range of temperatures (25 to 325°C) with the shear strain amplitude set at different values. The low cycle fatigue behavior of the sintered lap shear joint was found to be strongly dependent on test temperature. To...
Low temperature sintered nano-silver paste becomes a potential alternative in green electrical packaging because of its higher thermal and electrical conductivity than conventional solders. It can be used for connected chips that require high temperature operation, such as high power LED and power electronics modules, etc. During service, alternating shear strain, even thermal fatigue failure will...
Heat dissipation for packaging high-power light-emitting diodes is critically important to performance and reliability of LED lighting modules. The first thermal interface encountered by the heat flow is a die-attach material between the diode chip and its substrate. In this study, three different types of die-attach materials were used to construct 1-Watt GaN LED single-chip modules: a silver epoxy...
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