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With the ever-growing number of MEMS resonator applications, an research effort is required. One important step to consider in the design and evaluation phase is the packaging of such a resonator. Packaging has proven to be a problem and this research focuses on the backgrinding of wafers. Backgrinding introduces a tape application and removal step on the active side of the wafer. This paper shows...
In the growing MEMS market wafer level thin film packages can be applied to an increasing number of MEMS devices. This paper discusses the effects of common assembly processes on wafer level thin film packages. All assembly processes are discussed and the effects of the process on the structures is presented. From the assembly tests the grinding process poses the largest hazards followed by dicing,...
This paper presents our effort to predict reliability problems for MEMS packages. MEMS devices are vulnerable to the external loads subjected to it. As such, MEMS devices need to be protected. Capping the device can generate protections: a piece of silicon is placed on top of it to create a cavity above it. Parametric Finite Element models are combined with dedicated verification experiments to address...
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