The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In this paper, pure silver (Ag) joints between silicon (Si) chips and copper (Cu) substrates are produced successfully at a temperature much lower than its melting point. Silver is ductile and has low-yield strength. It can deform to release the shear stress caused by the large mismatch in coefficient of thermal expansion between Si and Cu. Silver also has the highest electrical conductivity and thermal...
Direct bonding between large silicon (Si) chips and copper (Cu) substrates using pure silver (Ag) as bonding material has been successfully developed. The Si-Ag-Cu direct bonding process was performed in two assembly structures, die attachment and flip-chip interconnect, at low process temperature of 250degC. It is a typical reflow temperature of lead-free (Pb-free) solders. In die attachment structure,...
A fluxless bonding process between silicon and copper with high-temperature Ag-Sn joint is developed by low temperature bonding using Ag-Sn-Au multilayer composite structure. The copper substrate is plated with a thick silver layer as stress buffer. We bond 5mmtimes5mm silicon chips onto Ag/copper substrates using electroplated lead-free Ag-Sn-Au solder. Si chips were produced with two different kinds...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.