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During the last few years, there has been rapidly increasing interest in the use of die attach adhesive applied to the back of silicon wafers. Adhesives in the form of solid films are already in widespread use - mainly in die stacking of large memory devices. However, there is also increasing use of Wafer Backside Coating (WBCTM) adhesives in cost-sensitive IC applications for attaching small die...
Over the past fifteen years, Goddard Space Flight Center has developed several successful science missions in-house: the Wilkinson Microwave Anisotropy Probe (WMAP), the Imager for Magnetopause-to-Aurora Global Exploration (IMAGE), the Earth Observing 1 (EO-1), and the Space Technology 5 (ST-5) missions, several Small Explorers, and several balloon missions. Currently in development are the Solar...
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