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Flip-chip-on-board technology has gained its acceptance rapidly in printed circuit board assembly as one of choices for electrically challenged, form factor sensitive and high interconnect density applications. Due to the significant mismatch in the coefficients of thermal expansion among the materials of silicon chip and motherboard, solder bumps are subject to large thermal induced stresses which...
Handheld and portable consumer electronics devices are getting lighter and smaller these days. As a major consumer electronics storage device, hard drive has gained its acceptance rapidly as one of the choices for higher reliable, lower price and faster accessing consumer electronics applications. Design of printed circuit board assembly for hard drives is hence moving towards higher performance and...
Thermal induced warpage of printed circuit boards during high temperature reflow of assembly process can cause significant production and reliability problems. Fine solder pad pitch, high component density, and low thickness profile are commonly adopted in advanced printed circuit board development nowadays. Moreover, lead-free solder joint requires higher reflow temperature which generates more severe...
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