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We review recent advances in the development of silicon photonic integrated circuits for high-speed and high-capacity interconnect applications. We present detailed design, fabrication, and characterization of a silicon integrated chip based on wavelength division multiplexing. In such a chip, an array of eight high-speed silicon optical modulators is monolithically integrated with a silicon-based...
We present recent results of a silicon photonic integrated chip that is capable of transmitting data at an aggregate rate of 200 Gb/s. It is based on wavelength division multiplexing where an array of eight high speed silicon optical modulators are monolithically integrated with a demultiplexer and a multiplexer. The modulators, each capable of 25 Gb/s data transmission, are based on the carrier depletion...
This paper talks about the developments in silicon photonic devices which exploit the inherent high refractive index contrasts achievable on an SOI platform. We will focus on the optical modulator which has been designed for speeds up to 40Gbps. We will also describe the design and performance of a photonic integrated transmitter chip, which has been demonstrated to transmit at an aggregate data rate...
In this paper, we review recent results of high-speed silicon photonic modulators based on electrical-field-induced carrier depletion effect in a silicon-on-insulator waveguide. We also present detailed design, fabrication, and characterization of a photonic integrated circuit on a silicon platform. We demonstrate an aggregate data transmission rate of 200 Gb/s with 8 channels wavelength division...
We report a silicon photonic integrated circuit that contains a fast silicon optical modulator array and wavelength multiplexer/de-multiplexer. We demonstrate high-speed data transmission with an aggregate data rate of 200 Gbps on a single silicon chip.
We review recent results of silicon photonic component research and photonic integration on silicon platform. In particular, we present design, fabrication, and characterization of a high-speed photonic integrated circuit that is capable of transmitting data at 200 Gb/s.
We review silicon photonic technologies enabling low-cost photonic integrated circuits (PIC) for future optical interconnects. In particular, we discuss design, fabrication, and characterization of a high-speed silicon optical modulator capable of transmitting data up to 30 Gbps.
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