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A novel 3D computational self-consistent electro-thermal modeling methodology is developed to more precisely analyze leakage currents in nanoscale FinFET devices. The coupled electro-thermal modeling is applied to compare the device performance of poly-Si gate and metal-gate DG-FinFET. Results show very high leakage current in band-edge metal-gate device and poly-Si gate device. Mid-gap metal-gate...
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