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Through silicon via (TSV) has been extensively highlighted as the key solution for small form factor wide bandwidth, and low power consumption with compactly integrating multiple chips. Despite the many advantages of TSV based 3-dimensional integrated circuit (3D IC), there are several challenges to be overcome such as noise coupling, fabrication process limits, and failure issues. In this paper,...
Wireless power transfer (WPT) technology has recently emerged as an innovative and promising technology, and its electromagnetic compatibility (EMC) has become a significant issue. In this study, we investigated the electromagnetic (EM) radiated emission and interference generated by WPT systems using resonant magnetic field coupling, especially in applications with multi-coil configurations. The...
In this study, magnetically coupled coil design for high efficiency wireless power transfer (WPT) in PCB-toactive silicon (Si) interposer is proposed and analyzed using Z-parameter analysis. For strong magnetic coupling between transmitter (Tx) coil on PCB and receiver (Rx) coil on Si-interposer, each coil structure is selected considering process dimension difference between PCB and Si-interposer...
In this paper, we present the analysis of electrostatic discharge (ESD) effects in wireless power transfer (WPT) using magnetic resonance coupling. For analyzing ESD effects, we use the simple equivalent circuit model which consists of self-inductance, mutual inductance, parasitic resistance, and capacitance. The ESD pulse is generated by the model of an ESD generator. The generated ESD pulse is injected...
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