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In this paper, we extended the silicon (Si) etching behavior using CO2 laser with glass attached to the Si backside. The CO2 laser with a wavelength of 10.64 mum is not absorbed by Si material and cannot do any micromachining for pure Si. However, Si becomes able to be etched by CO2 laser as we put a glass below Si. The etching occurs from the top surface of Si downward to the bottom. If the time...