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60GHz-band 500-Mpbs transmitter and receiver multi-chip modules (MCMs) are presented, in which MMICs and a filter are mounted using flip-chip bonding technique. A multi-layer Low Temperature Co-fired Ceramic (LTCC) substrate is adopted for a package. The MCMs are directly bonded with printed wiring boards using ball grid array technique, achieving connections for signals and biasing. A developed 500-Mbps...