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In this paper, the interfacial nanoscale bondability between copper (Cu) and Aluminum (Al) intermetallic compound (IMC) for Cu wirebonding has been carefully investigated. Preliminary results demonstrated that IMC cracks from the edge of bonding interface and spreads into the center area. This is the cause of open fail. The IMC between Cu and Al was initially generated in the form of CuAl2, and gradually...
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