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This paper presents a local oscillation (LO) distribution network for the purpose of power splitting and distribution from a voltage-controlled oscillator (VCO) to a transmitter (Tx), receiver (Rx) and phase-locked loop (PLL) frequency synthesizer for an on-chip 60-GHz transceiver. The proposed LO distribution network architecture includes one input port and three output ports. The network circuit...
This work describes the first multiband WCDMA/HSPA/EGPRS single-chip transceiver with GPS and receiver diversity. This device supports UMTS bands 1,2,3,4,5,6,8,9,10 and GSM/EDGE 800, 900, 1800, 1900 MHz bands. It is implemented in cost-effective 0.18 mum RF CMOS technology and uses a reduced number of TX and RX SAW filters.
This paper describes the system architecture and design procedure for an integrated 60-GHz direct-conversion transceiver with integrated digital control interface on a 130-nm CMOS process. This transceiver incorporates both a transmitter and receiver. The transmitter achieves a Psat of 6.5 dBm, an OPldB of 1.6 dBm. The receiver achieves a conversion gain of 8.1 dB with an IIP3 of -13.74 dBm.
Modern systems require transceivers that deliver gigabit speeds are smaller in size with lower power consumption and cost than existing technology consequently high speed transceivers operating at 60 GHz and delivering multi-gigabit per second are receiving significant research interest. This paper describes a 60-GHz transmitter developed and tested on a 130-nm CMOS process.
The spectrum around 60 GHz is available for unlicensed operation in many regulatory domains including the USA, Japan, Canada and Australia. One of the applications of this spectrum is for short range communication systems. These systems are designed to deliver gigabit speeds, consuming small amount of power in small form factor. The small factor is achieved because passive components scale with carrier...
Modern systems require transceivers that deliver gigabit speeds, are smaller in size, and have lower power consumption and cost. This motivates research to develop transceiver-on-chip and transceiver-in-a-package technologies. Recent advances in millimetre wave electronics have meant that significant portions of the system can now be integrated onto a single substrate or package. In order to achieve...
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