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In this study, the interfacial reaction between Sn-3.0Ag-0.5Cu solder on Cu-35wt%Zn, Cu-20wt%Zn-15wt%Ni and Cu-25wt%Zn-10wt%Ni substrates were studied after reflow at 250°C for 90s and isothermal aging at 150°C for 50, 100, 250, and 500h. Addition of Zn or Ni into Cu wetting layer was effective to suppress the excessive growth of IMC and avoid the microvoids formation after thermal aging. In the initial...
We developed an Au/Ni-Zn/Ti under bump metallurgy (UBM) for Pb-free solders. Au/Ni-Zn/Ti and Au/Ni/Ti UBM stacks were deposited on SiO2/Si wafer using conventional magnetron sputtering and Sn solder was electroplated on UBM stacks. Then, Sn solder on UBM were reflowed at 260°C for 15 s and aged at 150°C up to 1000 h. The measurement of film stress using a curvature method showed Ni-Zn films having...
In this paper, we propose a new diagnosis method of DC/DC converter aging. The method is based on the variations of parasitic resistor for the aging process. We apply an on-line diagnosis of DC/DC converter from the system point of view, not device-wise, but a system. This study proposes a method of DC/DC converter diagnosis by analyzing the variations of model on the variations of parasitic resistor.
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