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The reliability of a stacked ball grid array (stacked BGA) package during the solder reflow process was examined using the finite element method (FEM). The stress intensity factors (SIFs) at an interfacial crack tip in the stacked BGA package were analyzed. Vapor pressure on the surfaces of an initial crack and thermal stress were considered. The vapor pressure during the solder reflow was estimated...
Diffusion of 59 Fe in single crystalline γ-TiAl intermetallic compound has been investigated by the ion-beam sputter-sectioning technique in the temperature range from 1123 to 1303 K. The diffusion coefficients measured in the directions parallel (D 33 ) and perpendicular (D 11 ) to the [001] axis exhibit significant anisotropy; the diffusion of 59 ...
Tracer diffusion of 44 Ti and 63 Ni in γ-TiAl has been investigated using single crystal samples by the ion-beam sputter-sectioning technique in the temperature range from 1133 to 1307K and from 1053 to 1278K, respectively. The tracer diffusion coefficients have been measured in the directions parallel and perpendicular to [001] axis. The diffusion of 44 Ti in...
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