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In order to reduce scratches attributed to the CMP (chemical mechanical planarization) polishing processes, defect-causing large particle counts must be reduced to improve semiconductor yields. CMP slurry filtration is considered as a critical enabler of these yield improvements. As the process technology advances, the abrasive concentrations of CMP slurries will continue to be lowered while abrasive...
Reduced device feature size and new device manufacturing processes require more efficient management and control of the chemical mechanical planarization (CMP) process. One of the key parameters to lower defectivity is to control contaminants through the use of a CMP filter operation [1]. This paper discusses CMP slurry filtration methodologies and mechanisms along with the relationship between particle...
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