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Advanced bright field (BF) inspector have many functions to increase the defect signal, and suppress the background noise. However, it will take much time to fine tune an optimized BF inspection recipe. The aim of this paper is to propose a faster way to select the optimized optics.
Advanced high performance dark field (DF) inspection is usually utilized at larger defects and the excursions in etch, chemical mechanical polish (CMP) or film deposition processes inspection at high production throughputs. Here demonstrates risky scratch defects right after post poly-silicon CMP captured by DF inspection technique.
Advanced bright field (BF) inspection tool bundles with many powerful features to improve its resolution and sensitivity. However, it usually takes much time for creating an effective monitoring recipe for suppressing the background signal. This paper demonstrates the benefit of BF dark mode inspection for suppressing the interferences of nuisance and pre-layer.
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