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In the area of full duplex (FD)-enabled small cell networks, limited works have been done on consideration of cache and mobile edge communication (MEC). In this paper, a virtual FD-enabled small cell network with cache and MEC is investigated for two heterogeneous services, high-data-rate service and computation-sensitive service. In our proposed scheme, content caching and FD communication are closely...
This paper presents the methods of eliminating the plasma-induced Si substrate damage in periphery regions, resulting from high aspect ratio etching process for 3D NAND fabrication. The impact of Si substrate damage is verified by the low and high bias power experiments. The result indicates more Si damage is present with high energy bombardment; therefore, high bias power is recommended to be inhibited...
This paper presents the methods of eliminating the plasma-induced Si substrate damage in periphery regions, resulting from high aspect ratio etching process for 3D NAND fabrication. The impact of Si substrate damage is verified by the low and high bias power experiments. The result indicates more Si damage is present with high energy bombardment; therefore, high bias power is recommended to be inhibited...
NF3/NH3 remote plasmas are used in oxide etch back process prior to the salicide process of word lines (WL) owing to high etch selectivity of silicon oxide over polysilicon. The etch saturation behavior which performs etch stop with a certain period of process time is one of the interesting characteristics during oxide etch process by employing NF3/NH3 remote plasmas. In this study, it is found that...
Layered broadcast/multicast mechanism is a promising method to provide energy efficient and reliable services for users with diverse fading channels in Green 4G wireless networks, however, there is a great challenge to determine the optimal modulation parameters in applications due to the varying wireless environment and the technique characteristics. In this work, an Energy efficient Layered Broadcast/Multicast...
This investigation employs an optimized method to alleviate defects occurring at BF2+ implanted source/drain areas, some white spots defects found at scribes lines after BPSG (boron and phosphorus doped silicon glass) anneal. The results of physical failure analysis indicate the white spot defects are relative to outgassed fluorine that can't be released out during BPSG thermal annealing. Various...
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