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The risk of chip damage due to ultrasonic stresses in ball bonding needs to be managed while assuring a high bond strength. Chips with low-k dielectrics are less robust than those with SiO2, and if novel Cu or Pd coated Cu bonding wire is used, larger stresses are common during bonding. A finite element model can predict stresses at all locations under the pad including those due to the dynamics of...
Microelectronic wire bonding is an essential step in today's microchip production. It is used to weld (bond) microwires to metallized pads of integrated circuits using ultrasound with hundreds of thousands of vibration cycles. Thermosonic ball bonding is the most popular variant of the wire bonding process and frequently investigated using finite element (FE) models that simplify the ultrasonic dynamics...
Film bulk acoustic resonators (FBARs) show many unwanted "spurious modes". They all are energy-trapped modes and therefore arise - in addition to the main resonance - as ripples in the resonator's admittance. Furthermore, non-trapped modes reduce resonator quality due to leaking energy to the environment of the resonator. Since the excitation of both spurious and non-trapped modes has been...
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