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Ball bonding processes are optimized on Al pads with a 25.4 ??m diameter Cu wire to obtain maximum average shear strengths of at least 120 MPa. To quantify the direct effect of bond force and ultrasound on the pad stress, ball bonding is performed on test pads with piezoresistive microsensors integrated next to the pad and the real-time ultrasonic signals are measured. By using a lower value of bond...
Thermosonic ball bonding processes on test chips with Al metallized bonding pads are optimized with one Au and two Cu wire types, all 25 mum diameter, obtaining average shear strengths of more than 120 MPa. The process temperature is ~110degC. Ball bonds made with Cu wire show at least 15% higher shear strength than those made with Au wire. The estimated maximum shear strength cpk value determined...
Ball bonding processes on test chips with Al metallized bonding pads are optimized with one Au and two Cu wire types, all 25 mum diameter, obtaining average shear strengths of more than 120 MPa. The process temperature is about 110degC. The results demonstrate that ball bonds made with Cu wire show at least 15% higher shear strength than those made with Au wire. The estimated maximum shear strength...
Classical finite element methods are only capable of describing a limited computation area; the substrate of a micro-acoustic device must therefore be described by suitable boundary conditions. This is obtained by absorbing boundary conditions (ABC) or perfectly matched layers (PML) which both suppress reflections from the substrate. PML was implemented into a high-performance finite element code...
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