Search results for: Hsien-Chie Cheng
Journal of Electronic Materials > 2018 > 47 > 3 > 1832-1846
Solid State Sciences > 2017 > 68 > C > 10-18
Computational Materials Science > 2017 > 133 > C > 35-44
Journal of Alloys and Compounds > 2016 > 689 > C > 857-864
Journal of Materials Science > 2017 > 52 > 6 > 3225-3232
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 10 > 1493 - 1504
Computational Materials Science > 2016 > 117 > C > 127-138
Materials Chemistry and Physics > 2016 > 174 > C > 70-80
Microelectronics Reliability > 2016 > 59 > C > 84-94
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 3 > 432 - 446
Intermetallics > 2015 > 62 > Complete > 60-68
Journal of Alloys and Compounds > 2015 > 619 > C > 576-584
Journal of Electronic Materials > 2015 > 44 > 4 > 1220-1237
Thin Solid Films > 2014 > 557 > C > 316-322
IEEE Transactions on Device and Materials Reliability > 2014 > 14 > 1 > 499 - 511