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This paper forwards two TSV positioning algorithm named middle-cut positioning (MCP) and optimized area positioning (OAP). In 3D IC placement, TSV occupies cell area and its position does affect the real wire length which is ignored in previous works. Its effect should be considered by TSV based wirelength calculation and TSV positioning. Experiments are carried out on 2D-3D transformation of IBM...
This paper forwards a novel wire length calculation algorithm based on TSV position. Typical 2D wire length calculation method such as half-perimeter model does not take via position into account. But in 3D IC placement, TSV position does affect the real wire length which is ignored in previous works. To get accurate wire length data and help 3D placement researches, this paper forwards the TSV based...
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