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Utilizing an integrated optical-tunable-delay-line, reversely-modulated single sideband modulation, and Nyquist subcarrier modulation, we demonstrate an 8 Gbps mm-wave beam steered link with a spatial-spectral efficiency of 16 bits/s/Hz.
2.5D silicon interposer, for a cost effective optoelectronic package, is proposed and fabricated on a wafer level. Using this packaging approach, the fully assembled 120 Gb/s transmitter is scaled down to 6mm × 7mm.
We demonstrate a method for stacking and connecting KGD on each other. The method requires no pre-processing of the ICs and die placement can be done using standard pick and place machines. This novel process allows creating >200um high lithographically defined interconnects and is a simple, scalable and low cost alternative to other techniques for interconnecting 3D stacked ICs.
The challenges of scaling data center networks while attempting to flatten them are explored in this tutorial. Here we highlight the clear advantages of using high radix switches and explain why coupling such switches with mid-board mounted optics can be a winning solution.
With the exponential growth of data centers, in terms of number of hosts and capacity, the required components for building data center networks are stretched to their limits. In this talk we will discuss a new technology developed for interconnecting electronic and opto-electronic ICs in order to revolutionize the way parallel optics are fabricated and packaged so that demands in terms of cost, power,...
A photonic integrated mode coupler based on silicon-on-insulator is employed for mode division multiplexing (MDM) over a 193 m 19-cell hollow-core photonic bandgap fibre (HC-PBGF) with a -3 dB bandwidth >120 nm. Robust MDM transmissions using LP01 and LP11 modes, and two degenerate LP11 modes (LP11a and LP11b) are both experimentally verified.
The effective mechanical properties of polymethyl-methacrylate (PMMA) reinforced with carbon nanotubes (CNTs) were evaluated by means of two approaches: experiments and a micromechanical model. With various concentrations of CNTs, two specimen fabrication processes were examined: hot pressing (HP) and injection molding (IM). Experiments included a series of uniaxial tensile tests guided by an ASTM...
Wafer scale fabrication of the 3D stacked transceivers is discussed. Uniform open eye patterns at 10 Gb/s/channel of both 3D stacked transmitter and receiver ICs indicates that the interconnection technology is robust.
As silicon photonics continues to gain research and industrial relevance, some of the building blocks in this technology such as modulators and switches still suffer from limitation when it comes to insertion losses and/or extinction ratio. In the past two years we have been investigating a promising new building block for silicon on insulator (SOI) circuits which is based on ultra-thin narrow stripes...
We demonstrate a wafer-scale process for making compact 3D stacked 10×10 Gbps transmitter chips. Error-free operation is obtained for 0 and 500 meter transmission in OM4-Plus fiber with a maximum 1.4 dB Rx sensitivity penalty.
Improved passive signal regeneration performance based on bonded InP membrane waveguides is demonstrated. A tripling of the ER and receiver sensitivity enhancement of >3.6dB is achieved over the entire C-band at a bitrate of 2.5Gb/s.
Operation of an optically controlled 1×4 remote node, based on membrane InP switches and SOI waveguide circuits, is shown. Extinction ratio >25dB and penalty-free operation for 10Gb/s 231-1 PRBS data through the switch are demonstrated.
We discuss the use of active and passive InP membrane structures, heterogeneously integrated onto SOI passive circuits, for switching applications such as gating, wavelength conversion and all-optical flip-flopping. Devices include microdisk lasers and resonators, as well as travelling wave structures, in either electrically pumped or unpumped configuration. We also pay some attention to the fabrication...
A receiver chip based on 3D stacking a photodiode chip directly on top of TIA CMOS IC is demonstrated. Open eye patterns are demonstrated for both 3D stacked receiver and transmitter chips and BER measurements of the transmitter show penalty free operation under uniform biasing conditions proving that the interconnecting technology is robust.
We demonstrate for the first time high-speed direct-modulation of InP microdisk lasers by exploiting longitudinal mode competition. High-speed operation is demonstrated by means of S21 and PRBS modulation. We show open eye diagrams and bit-error rates up to 10 Gb/s.
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