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Laser induced back side wet etching has shown to be a promising tool for the micro-structuring of transparent materials. Detailed studies have been performed using UV excimer laser sources, aromatic hydrocarbon and liquid metal absorbers. Only little work is reported however using aqueous Cu solutions as absorbers and ns laser pulses at 1064nm wavelength. We present a novel model for this specific...
A current challenge in laser processing is high precision micromachining of transparent materials, e.g. to manufacture microoptical elements. This can be achieved amongst others by using laser induced backside wet etching. Research has been done by several groups in the last years. Most of the published results were obtained by using UV excimer lasers. Our approach deals with the implementation of...
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