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Core vias found in the packages of high-speed ICs can have a large impact on overall channel performance. Thus accurately modeling core vias in the package is essential. In this paper analytical methodologies are used to calculate equivalent circuit models of core vias.
In this paper, A novel wide-band uniplanar electromagnetic band gap (EBG) structure composed of complimentary split ring resonator (CSRR) and X shape bridge, called the X-CSRR EBG structure, is proposed to suppress ground bounce noise (GBN) and simultaneous switching noise (SSN) in power ground plane. Compared with conventional uniplanar EBG structures, such as the AI-EBG structure and the S-EBG structure,...
High speed serial links usually have extremely tight requirement on the quality of the signal channels, in terms of insertion loss and return loss. Along with an end-to-end channel design, the transition from plated-through-hole (PTH) via to fan-out traces on printed circuit board (PCB) creates unavoidable impedance discontinuity, which greatly impacts the channel return loss performance. It is important...
High performance ASIC packages are typically mounted on the PCB using BGA solder ball technology; ASIC package to board BGA transition creates impedance discontinuity in the multi-gigabit signaling channel. It is important to understand and model this discontinuity accurately to improve end to end channel design in system level. Usually when the channel is simulated, instead of modeling the package...
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