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A Si ultra-thin body (UTB) junctionless field-effect transistor (UTB-JLFET) with LG = 1 nm and LG = 3 nm have been demonstrated by solving the coupled driftdiffusion (DD) and density-gradient (DG) model. The simulation results show that the Si can be used in ultra-short channel device as long as UTB is employed. As UTB is employed, ultra-short channel device does not need to follow an empirical rule...
Agate-all-around (GAA) with trench structure poly-Si channel junctionless Field-Effect Transistor (JL-FET) has been successfully demonstrated. This JL-FET shows excellent performance in a low drain-induced barrier lowering (DIBL), a steep Sub-threshold Swing (SS) ∼70 mV/decade and high ION/IOFF (>108) ratio.
GaN heterojunction field-effect transistors (HFETs) in the 600-V class are relatively new in commercial power electronics. The GaN Systems GS66508 is the first commercially available 650-V enhancement-mode device. Static and dynamic testing has been performed across the full current, voltage, and temperature range to enable GaN-based converter design using this new device. A curve tracer was used...
We investigated the device performance of the optimized 3-nm gate length ($L_{G})$ bulk silicon FinFET device using 3-D quantum transport device simulation. By keeping source and drain doping constant and by varying only the channel doping, the simulated device is made to operate in three different modes such as inversion (IM) mode, accumulation (AC) mode and junctionless (JL) mode. The excellent...
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