The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The paper discusses current challenges and advantages of multi-level signaling for high-speed serial links, showing the differences and similarities in link-path analysis between binary and multi-level signaling. Comparison of two signaling methodologies is given from the general theory viewpoint, as well as on the basis of various tests regarding crosstalk, jitter, equalizations and different channel...
In this work the circuit segmentation approach for the modeling of Through Silicon Vias (TSV) is extended to the presence of time domain non linear phenomena such as depletion and capacitance hysteresis. Results are shown discussing the impact of the voltage bias on the above mentioned non-linear phenomena and their combined impact on crosstalk among TSV and between TSVs and active circuits.
This paper looksat the impact of consideringthe exact or approximated values for the nonlinear depletion capacitance in a TSV equivalent circuit for transient analysis. Furthermore, the effects of the time variant and nonlinear behavior of the doped bulk silicon substrate on signal propagation and crosstalk are also studied.
The quality and the reliability of the electrical interconnection have a direct impact on the performance of the MEMS/NEMS devices. In this work, reliable electric interconnection for MEMS/NEMS devices was realized by Au/a-Si (amorphous Si) eutectic reaction in the anodic wafer bonding process. In order to evaluate the qualities of the anodic bonded contact, the electrical property of the Au/a-Si...
A conduction model consisting of two parallel resistances from a highly conductive filament region and a uniform leakage oxide region is proposed in this brief to represent the current conduction in the filament-type switching resistive random access memory cell. Low-frequency noise analysis of current fluctuation at different resistance states has been employed to verify its efficiency. It is found...
Progress in the fabrication and performance of glass-clad crystalline semiconductor core optical fibers is reviewed. This new class of optical fibers may significantly advance applications in nonlinear optics and infrared power delivery.
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.