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An overview of commercially available large-scale photonic integrated circuits (PICs) in indium phosphide is provided. Results of 100-Gb/s PICs that are field-deployed in wavelength-division-multiplexing (WDM) networks is provided, along with development results showing scaling of both channel count and channel bit rate to implement next-generation PICs with an aggregate capacity of 1.6 Tb/s. Use...
Commercial scaling of electronic integrated circuits has proceeded at a fast pace once the initial hurdle to integration was overcome. Recently, it has been shown that record active and passive optical device counts, exceeding 50 discrete components, can be incorporated onto a single monolithic 100 Gbps DWDM transmitter PIC InP chip. We will investigate key production metrics for this large-scale...
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