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In this paper, we prepared the Bi2223 multifilamentary tapes with Ca 2 CuO 3 +Bi2212 as interfilamentary resistive barriers to suppress the electromagnetic coupling among the filaments under AC external magnetic field. The tapes with thin barrier layers of Ca 2 CuO 3 +30wt% Bi2212 around the filaments were prepared by using a standard powder-in-tube (PIT) method. The...