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Surface development origins from the cloth-making and computer graphics without consideration of the thickness, involving nonlinear optimization and constraints. Moreover the research of surface development mainly focuses on the planar development. In this paper, the development of the non-developable sheet to planar, singly-curved and doubly-curved surface patterns is investigated. An optimal developing...
The mechanism of wirebonding bondability for ultra thin Copper wire is described in this research. Two major analyses are conducted in the present paper. In the first, the characteristic of heat affected zone (HAZ) and free air ball (FAB) on thin Copper (Cu) wire have been carefully experimental measured. Thin film interfacial micro-tribology behavior between Cu FAB and Al pad is examined by Atomic...
The aim of present research is to investigate the characteristic of ultra thin copper wire and aluminum pad. In the first, the electric flame-off (EFO) characteristic of ultra thin copper wire has been carefully examined. Experimental results show thermal aging effect has significantly influence on the micro structure of free air ball (FAB). Optical microscopic (OM) examination for an as-drawn copper...
The finite element model of a light bus body is established. The vibration modalities are evaluated using finite element software. The simulated results are compared with test date. It shows that the model has represented the vibration characteristics of the original structure. The finite element model for the acoustic cavity is established. The first step modality in the longitudinal direction of...
In this paper, an advanced electro-thermo coupling model is developed to investigate the electromigration and electrothermo-mechanical effects on electronic packaging, especially on Package-on-Package (POP). POP packaging involves in ultra thin gold wire (phi = 1mil) on wirebonding and Sn4.0Ag0.6Cu (SAC405) solder ball on package. The current density arising in the aluminum pad (wirebonding) and in...
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