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This study reports the design of materials suitable for backing in piezocomposite devices specifically operating at frequencies above 30MHz. Tungsten loaded epoxy backing samples were made with varying volume fractions with l-5 mum tungsten powder and RX771/HY1300 epoxy. Higher volume fractions were achieved with high shear milling exploiting a new material fabrication technology using PVB polymer,...
High frequency ultrasonic transducers are needed for high spatial resolution measurements in applications such as medical diagnosis and nondestructive testing. However, cost-effective fabrication of high performance transducers with frequencies above 20 MHz is challenging because of the need for a thin layer of active material. Piezocomposites are the material of choice in such transducers at lower...
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