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The structure, thermal stability and diffusion bonding behaviour of oxygen free high conductivity copper (OFHC), and Cu–Cr–Zr alloy (CRZ) with ultra fine grains (UFG) produced by severe plastic deformation through equal-channel angular pressing (ECAP) are investigated. Microstructural study reveals a grain refinement from 150μm to 200nm sized grains after 8 ECAP passes. Thermal stability of ECAP processed...